• High Speed digital, Analog, Mixed and RF designs
  • High Density PCBs : > 500 pins / Sq.inch
  • High Layer count boards : 20+ layers
  • High Speed Interconnects : 3.125 Gbps
  • Impedance/Delay matching
  • Blind and Buried Vias
  • Fine Pitch BGA (0.5mm), High Pin count BGA (1764 pins)
  • Motherboards, High Speed Serial Backplanes, Single board computers
  • ASIC Evaluation boards, Probe Cards
  • Mechanically constrained PCBs
  • Expertise on Mentor Graphics and Cadence tools