- High Speed digital, Analog, Mixed and RF designs
- High Density PCBs : > 500 pins / Sq.inch
- High Layer count boards : 20+ layers
- High Speed Interconnects : 3.125 Gbps
- Impedance/Delay matching
- Blind and Buried Vias
- Fine Pitch BGA (0.5mm), High Pin count BGA (1764 pins)
- Motherboards, High Speed Serial Backplanes, Single board computers
- ASIC Evaluation boards, Probe Cards
- Mechanically constrained PCBs
- Expertise on Mentor Graphics and Cadence tools
