• High Speed digital, Analog, Mixed and RF designs
• High Density PCBs : > 500 pins / Sq.inch
• High Layer count boards : 20+ layers
• High Speed Interconnects : 3.125 Gbps
• Impedance/Delay matching
• Blind and Buried Vias
• Fine Pitch BGA (0.5mm), High Pin count BGA (1764 pins)
• Motherboards, High Speed Serial Backplanes, Single board computers
• ASIC Evaluation boards, Probe Cards
• Mechanically constrained PCBs
• Expertise on Mentor Graphics and Cadence tools